IMS

IMS

IMS - Insulated Metal Base

  • Model: Insulated Metal Base PCBs »
Feature technical specification
Number of layers1 - 4 layers
Technology highlightsEffective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
MaterialsAluminium & copper plates. FR-4, PTFE, thermal dielectrics.
Dielectric thickness0.05mm - 0.20mm
Thermal conductivity1-4 W/m/K
Profile methodPunching, Liquid cooled routing
Copper weights (finished)35μm - 140μm
Minimum track and gaps0.10mm / 0.10mm
Metal core thickness0.40mm - 3.20mm
Maxmimum dimensions550mm x 700mm
Surface finishes availableHASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver
Minimum mechanical drill0.30mm