| Number of layers | 1 - 4 layers |
| Technology highlights | Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems. |
| Materials | Aluminium & copper plates. FR-4, PTFE, thermal dielectrics. |
| Dielectric thickness | 0.05mm - 0.20mm |
| Thermal conductivity | 1-4 W/m/K |
| Profile method | Punching, Liquid cooled routing |
| Copper weights (finished) | 35μm - 140μm |
| Minimum track and gaps | 0.10mm / 0.10mm |
| Metal core thickness | 0.40mm - 3.20mm |
| Maxmimum dimensions | 550mm x 700mm |
| Surface finishes available | HASL, LF HASL, OSP, ENIG, Imersion tin, Immsersion silver |
| Minimum mechanical drill | 0.30mm |
