| Number of layers | 2 layers |
| Technology highlights | Epoxy glass dielectric materials laminated with copper cladding of varying thicknesses. |
| Materials | FR-4 standard, FR-4 high performance, FR-4 halogen-free. |
| Copper weights (finished) | 18μm - 210μm, advanced 1050μm / 30oz |
| Minimum track and gap | 0.10mm / 0.10mm |
| PCB thickness | 0.40mm - 3.2mm |
| Maxmimum dimensions | 510mm x 650mm |
| Surface finishes available | HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers |
| Minimum mechanical drill | 0.30mm standard, 0.20mm advanced |
